Method and exposure apparatus for performing a tilted focus and a device manufactured accordingly

ABSTRACT

A method for performing a tilted focus test includes the steps of providing a target object, providing a projection beam of radiation using a radiation source, providing a reflective device to introduce a projected projection beam of radiation onto the target portion, introducing a first projected projection beam of radiation onto the target object using the reflective device in a first orientation, using a tilting device for tilting the reflective device to a second orientation to provide a second projection beam with a tilt relative to said first projection beam, introducing a second projected projection beam of radiation onto the target object, and determining a lateral shift of the first and second projected projection beams on the target object and determining from said lateral shift a defocus of the target object with respect to the projected projection beam.

RELATED APPLICATIONS

This Application is a continuation-in-part of U.S. patent application Ser. No. 11/020,557 filed Dec. 27, 2004, now pending, and claims priority to U.S. Provisional Application No. 60/684,951 filed May 27, 2005, the entire contents of both being hereby incorporated by reference.

FIELD OF THE INVENTION

The invention relates to imaging. More particularly, the invention relates to a method for performing a tilted focus test. The invention further relates to an exposure apparatus and a device manufactured accordingly.

BACKGROUND OF THE INVENTION

A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that instance, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g. including part of one or several dies) on a substrate (e.g. a silicon wafer). Transfer of the pattern is typically via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. In general, a single substrate will contain a network of adjacent target portions that are successively patterned. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion at one time, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the “scanning”-direction) while synchronously scanning the substrate parallel or anti-parallel to this direction. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate.

Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or “target portion”, respectively. The substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool and/or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.

In order to image the pattern via the lens to the substrate, the layer of resist provided on the substrate should be in the focal plane of the projection system. Focus tests have been developed to test if the substrate is positioned correctly in which a test pattern provided by a test device is imaged on the layer of resist. Next, a latent image of the test pattern is made visible by performing, for instance, a post exposure bake. After this, the width of, for instance, a line of the created pattern could be measured using, for instance, a scanning electron microscope. By comparing this width with a previously obtained calibration graph (bossung curve) the defocus can be determined. It will be understood that the width of a line is minimal in the best focus position and will become larger with increasing defocus.

In some places this text refers to positioning the substrate in the focal plane of the projection system. It is understood that this should be read as positioning the layer of resist provided on the substrate in the focal plane of the projection system.

However, in telecentric focus tests, it is only possible to determine the absolute defocus, but not the relative defocus. The absolute defocus is the distance between the layer of resist and the focal plane, but does not provide information whether the resist is above or below the focal plane, i.e. the sign of the defocus can not be determined. The relative defocus is the distance between the layer of resist and the focal plane including the sign of the defocus. The relative defocus also provides information about whether the resist is above or below the focal plane. Telecentric focus tests only provide information about the absolute defocus and do not provide sufficient information for correcting the position of a substrate with respect to the projection system, since the sign of the absolute defocus is not known.

To overcome this problem, tilted focus tests have been developed. In such tilted focus tests, an image of the test pattern is projected under an angle, such that defocus not only results in a blurred image of a test device, but also in a lateral shift of the position of the imaged test device. Such tilted focus tests use devices to create a tilted beam, such as a wedge that is translucent for the light used, or a transmissive test device provided with a pattern that creates a diffraction pattern in which e.g. the minus one diffraction order is cancelled out. These state of the art techniques are discussed in more detail below, with reference to FIGS. 2 a, 2 b, 3 a, 3 b, 4 and 5.

In order to manufacture increasingly smaller lithographic devices having increasingly smaller dimensions, the wavelength of the radiation used is preferably chosen as small as possible. The use of extreme ultraviolet radiation, e.g. in a range of 5-20 nm, would therefore offer great advantages. It is known, however, that radiation having a relatively small wavelength, such as EUV radiation, does not easily penetrate through matter. Therefore, the prior art solutions described above and below with reference to FIGS. 2 a, 2 b, 3 a, 3 b, 4 and 5 to create a tilted beam cannot be used effectively for EUV radiation. In principal, it is possible to manufacture a reflective version of the known transmissive test devices provided with a pattern. However, this requires an accuracy that is difficult to obtain these days, as will be further explained below.

US2002/0015158 A1 discloses a method of detecting focus information based on illumination rays having different main ray incidence directions, which means that the projection beam is tilted. Images of marks are projected through an optical system. A blocking member is provided in the illumination system that can be positioned in the light beam. The blocking member is provided with an aperture to partially block the light beam in such a way that a tilted beam is generated.

In order to determine the lateral shift of the projected mark images with respect to a mark image projected using a non tilted beam, a reference is needed. According to US2002/0015158 A1, this is achieved by superimposing a first and a second image of a single mark on the reticle. The mark is first projected on a substrate using a tilted beam, and next, another projection on the substrate using a non tilted beam is superimposed on the previous one. In between the first and second projections, the blocking member is removed from the light path. The lateral shift is given by the mutual distance between the first and second projected marks on the substrate.

According to a further embodiment of US2002/0015158 A1, a first exposure is carried out using a first blocking member, and a second exposure is carried out using a second blocking member, where the first and second blocking members have an aperture that are opposite to each other, such that the tilts of the first and second exposure are opposite to each other and thus the sensitivity of the measurement method is doubled.

The tilted focus test as disclosed in US2002/0015158 A1 has however, some disadvantages. First, the blocking member must be specially designed to take into account the relative position of the marks on the reticle. This means that a blocking member needs to be designed with knowledge of the relative position of the mark on the reticle.

Second, according to US2002/0015158 A1 double exposure is needed to provide a reference, in between which the blocking member needs to be removed or replaced with another (opposite) blocking member. Therefore, this is a time-consuming procedure that reduces the throughput of the system.

US2002/0100012 A1 describes several ways to create a tilted beam for use in a tilted focus test. A tilted beam is obtained by blocking certain diffraction orders. The blocking can for instance be achieved by positioning a pellicle under the mask. A frame member holding the pellicle is then used to block a diffraction order of the mark. According to an alternative, part of the normally transparent part of the pellicle can be non-transparent, to block certain diffraction orders.

The options presented in US2002/0100012 have several disadvantages. Using the frame member to create a tilted beam is rather cumbersome. Additionally, this method is used if the angle under which the diffraction orders are emitted by the mark and the distance between the frame member and the mark are within certain limits with respect to each other. Using the normally translucent pellicle to block certain diffraction orders requires a specially adapted pellicle for each mark. The overall performance of the pellicle will decrease, as a result of the non-transparent parts, having a negative effect on the over-all performance of the system. Also, pellicles can not be used in applications using (extreme) ultraviolet radiation beams, as will be understood by a skilled person.

SUMMARY

In one configuration of the present invention a lithographic apparatus is provided that overcomes at least one of the above mentioned problems, including a lithographic apparatus that could be used in combination with (E)UV radiation.

According to one aspect of the invention, a method for performing a tilted focus test, comprises the steps of:

-   -   providing a target object;     -   providing a projection beam of radiation using a radiation         source;     -   providing a reflective device to introduce a projected         projection beam of radiation onto the target portion;     -   introducing a first projected projection beam of radiation onto         the target object using the reflective device in a first         orientation,     -   using a tilting device for tilting the reflective device to a         second orientation to provide a second projection beam with a         tilt relative to said first projection beam,     -   introducing a second projected projection beam of radiation onto         the target object,     -   determining a lateral shift of the first and second projected         projection beams on the target object and determining from said         lateral shift a defocus of the target object with respect to the         projected projection beam.

By using a tilt device to provide the projection beam with a tilt, the patterned beam can be provided with a tilt and a tilted defocus test can be performed.

SHORT DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

FIG. 1 depicts a lithographic apparatus;

FIGS. 2 a and 2 b depict a telecentric focus test according to the state of the art;

FIGS. 3 a and 3 b depict a tilted focus test according to the state of the art;

FIG. 4 depicts a wedge for providing a tilted beam according to the state of the art;

FIG. 5 depicts a pattern for providing a tilted beam according to the state of the art;

FIG. 6 provides a more detailed view of a lithographic apparatus;

FIGS. 7 a and 7 b depict a detail of the lithographic apparatus according to an embodiment of the invention;

FIGS. 8 a, 8 b, 8 c and 8 d depict determination of defocus of an image by measuring a relative shift between tilted beams, in accordance with an embodiment of the invention;

FIG. 9 a depicts determination of defocus of an image by measuring a relative shift between tilted beams, in accordance with another embodiment of the invention; and

FIG. 10 depicts determination of defocus of an image by measuring a relative shift between tilted beams, in accordance with a further embodiment of the invention.

DETAILED DESCRIPTION

FIG. 1 schematically depicts a lithographic apparatus according to one embodiment of the invention. The apparatus comprises:

-   -   an illumination system (illuminator) IL configured to condition         a radiation beam B (e.g. UV radiation or EUV radiation).     -   a support structure (e.g. a mask table) MT constructed to         support a patterning device (e.g. a mask) MA and connected to a         first positioner PM configured to accurately position the         patterning device in accordance with certain parameters;     -   a substrate table (e.g. a wafer table) WT constructed to hold a         substrate (e.g. a resist-coated wafer) W and connected to a         second positioner PW configured to accurately position the         substrate in accordance with certain parameters; and     -   a projection system (e.g. a refractive projection lens system)         PL configured to project a pattern imparted to the radiation         beam B by patterning device MA onto a target portion C (e.g.         comprising one or more dies) of the substrate W.

The illumination system may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.

The support structure supports, i.e. bears the weight of, the patterning device. It holds the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithographic apparatus, and other conditions, such as for example whether or not the patterning device is held in a vacuum environment. The support structure can use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device. The support structure may be a frame or a table, for example, which may be fixed or movable as required. The support structure may ensure that the patterning device is at a desired position, for example, with respect to the projection system. Any use of the terms “reticle” or “mask” herein may be considered synonymous with the more general term “patterning device.”

The term “patterning device” used herein should be broadly interpreted as referring to any device that can be used to impart a radiation beam with a pattern in its cross-section such as to create a pattern in a target portion of the substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern includes phase-shifting features or so called assist features. Generally, the pattern imparted to the radiation beam will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit.

The patterning device may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. Masks are well known in lithography, and include mask types such as binary, alternating phase-shift, and attenuated phase-shift, as well as various hybrid mask types. An example of a programmable mirror array employs a matrix arrangement of small mirrors. each of which can be individually tilted so as to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern in a radiation beam which is reflected by the mirror matrix.

The term “projection system” used herein should be broadly interpreted as encompassing any type of projection system, including refractive, reflective, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system”.

As here depicted, the apparatus is of a reflective type (e.g. employing a reflective mask). Alternatively, the apparatus may be of a transmissive type (e.g. employing a transmissive mask).

The lithographic apparatus may be of a type having two (dual stage) or more substrate tables (and/or two or more mask tables). In such “multiple stage” machines the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposure.

The lithographic apparatus may also be of a type wherein at least a portion of the substrate may be covered by a liquid having a relatively high refractive index, e.g. water, so as to fill a space between the projection system and the substrate. An immersion liquid may also be applied to other spaces in the lithographic apparatus, for example, between the mask and the projection system. Immersion techniques are well known in the art for increasing the numerical aperture of projection systems. The term “immersion” as used herein does not mean that a structure, such as a substrate, must be submerged in liquid, but rather that liquid is located between the projection system and the substrate during exposure.

Referring to FIG. 1, the illuminator IL receives a radiation beam from a radiation source SO. The source and the lithographic apparatus may be separate entities, for example, when the source is an excimer laser. In such cases, the source is not considered to form part of the lithographic apparatus and the radiation beam is passed from the source SO to the illuminator IL with the aid of a beam delivery system BD comprising, for example, suitable directing mirrors and/or a beam expander. In other cases the source may be an integral part of the lithographic apparatus, for example when the source is a mercury lamp. The source SO and the illuminator IL, together with the beam delivery system BD if used, may be referred to as a radiation system.

The illuminator IL may comprise an adjuster AD for adjusting the angular intensity distribution of the radiation beam. Generally, at least the outer and/or inner radial extent (commonly referred to as σ-outer and σ-inner, respectively) of the intensity distribution in a pupil plane of the illuminator can be adjusted. In addition, the illuminator IL may comprise various other components, such as an integrator IN and a condenser CO. The illuminator may be used to condition the radiation beam, to have a desired uniformity and intensity distribution in its cross-section.

The radiation beam B is incident on the patterning device (e.g., mask MA), which is held on the support structure (e.g., mask table MT), and is patterned by the patterning device. Having traversed the mask MA, the radiation beam B passes through the projection system PL, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and position sensor IF2 (e.g. an interferometric device, linear encoder or capacitive sensor), the substrate table WT can be moved accurately, e.g. so as to position different target portions C in the path of the radiation beam B. Similarly, the first positioner PM and another position sensor IF1 can be used to accurately position the mask MA with respect to the path of the radiation beam B, e.g. after mechanical retrieval from a mask library, or during a scan. In general, movement of the mask table MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioner PM. Similarly, movement of the substrate table WT may be realized using a long-stroke module and a short-stroke module, which form part of the second positioner PW. In the case of a stepper (as opposed to a scanner) the mask table MT may be connected to a short-stroke actuator only, or may be fixed. Mask MA and substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. Although the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in spaces between target portions (these are known as scribe-lane alignment marks). Similarly, in situations in which more than one die is provided on the mask MA, the mask alignment marks may be located between the dies.

The depicted apparatus could be used in at least one of the following modes:

1. In step mode, the mask table MT and the substrate table WT are kept essentially stationary, while an entire pattern imparted to the radiation beam is projected onto a target portion C at one time (i.e. a single static exposure). The substrate table WT is then shifted in the X and/or Y direction so that a different target portion C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure.

2. In scan mode, the mask table MT and the substrate table WT are scanned synchronously while a pattern imparted to the radiation beam is projected onto a target portion C (i.e. a single dynamic exposure). The velocity and direction of the substrate table WT relative to the mask table MT may be determined by the (de-)magnification and image reversal characteristics of the projection system PL. In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) of the target portion in a single dynamic exposure, whereas the length of the scanning motion determines the height (in the scanning direction) of the target portion.

3. In another mode, the mask table MT is kept essentially stationary holding a programmable patterning device, and the substrate table WT is moved or scanned while a pattern imparted to the radiation beam is projected onto a target portion C. In this mode, generally a pulsed radiation source is employed and the programmable patterning device is updated as required after each movement of the substrate table WT or in between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array of a type as referred to above.

Combinations and/or variations on the above described modes of use or entirely different modes of use may also be employed.

Although specific reference may have been made above to the use of embodiments of the invention in the context of optical lithography, it will be appreciated that the invention may be used in other applications, for example imprint lithography, and where the context allows, is not limited to optical lithography. In imprint lithography a topography in a patterning device defines the pattern created on a substrate. The topography of the patterning device may be pressed into a layer of resist supplied to the substrate whereupon the resist is cured by applying electromagnetic radiation, heat, pressure or a combination thereof. The patterning device is moved out of the resist leaving a pattern in it after the resist is cured.

The terms “radiation” and “beam” used herein encompass all types of electromagnetic radiation, including ultraviolet (UV) radiation (e.g. having a wavelength of or about 365, 355, 248, 193, 157 or 126 nm) and extreme ultra-violet (EUV) radiation (e.g. having a wavelength in the range of 5-20 nm), as well as particle beams, such as ion beams or electron beams.

The term “lens”, where the context allows, may refer to any one or combination of various types of optical components, including refractive, reflective, magnetic, electromagnetic and electrostatic optical components.

FIGS. 2 a and 2 b schematically depict a simple and straight-forward prior art focus test. FIG. 2 a shows telecentric projection system PL comprising a first lens L1 and a second lens L2. In between the first lens L1 and the second lens L2 is a pupil plane PP. It will be understood that for reasons of simplicity only two lenses are depicted in FIG. 2, but that projection system PL may in general comprise any number of lenses. A test pattern provided on a test device P is imaged via projection system PL on the surface of a substrate W. The test device P may be a test device P being provided on a reticle MA. It may be a test device P that is specially added to the reticle MA for test purposes, but it may also be formed as part of the pattern on the reticle MA used for producing chips. The reticle MA may also be a reticle MA that is specially used for performing focus tests.

In the situation depicted in FIG. 2 a, the substrate W is substantially in the focal plane of the projection system PL and test device P is imaged as a sharp test structure P′. FIG. 2 b shows the same components, but now substrate W is positioned above the focal plane of the projection system PL. Test structure P is now projected as a blurred test structure P″. It will be understood that the amount of blurring depends on the amount of defocus. However, the amount of blurring does not depend on the direction of the defocus: if substrate W would have been positioned a similar distance below the focal plane of the projection system PL, the same amount of blurring would have been generated. Based on the test structure P″ it is impossible to determine whether the substrate W is above or below the focal plane of the projection system PL.

The amount of blurring can be measured by measuring the width of, for instance, a line of the created pattern after developing using for instance a scanning electron microscope (SEM). Since the behavior of the width with varying defocus is known from a previously obtained bossung curve. This behavior is relatively flat and thus very insensitive for variations in the defocus. The behavior is quadratic, so the sensitivity around best focus is substantially zero.

Therefore, tilted focus tests have been employed, as schematically depicted in FIGS. 3 a and 3 b. These tilted focus tests guarantee a linear behavior and a sufficiently high sensitivity. The same reference symbols refer to the same items. The image beam used for projecting an image of the test structure provided on the test device P on the surface of the substrate W is now tilted. FIG. 3 a shows imaging of a test device P through the projection system PL, where the substrate W is in the focal plane of the projection system PL. FIG. 3 b depicts a situation in which the substrate W is above the focal plane of the projection system PL and it can been seen that the test device P is now imaged as a blurred and laterally shifted test structure P′″. The center of the blur P′″ is laterally shifted with an amount Δx with respect to the position it would have had in case the substrate W would have been in the focal plane of the projection system PL, as depicted in FIG. 3 a. As a result, the lateral displacement Δx depends on the amount of defocus D. The direction of the lateral shift Δx (in the positive or negative x direction) provides information about the direction of the defocus. In case the lateral shift is in the positive x-direction, the substrate W is above the focal plane of the projection system PL, and vice versa. Based on such a tilted focus test it is thus possible to measure and as a further step also correct the relative position of the substrate W and the projection system PL. In principle, it is also possible to adjust the setting of the projection system. Several methods are known to create such a tilted beam. FIG. 4 depicts a wedge 10 that provides the image beam with a tilt and shifts the complete intensity distribution. Such a wedge 10 may, for instance, be made of quartz. The wedge 10 may, for instance, be positioned on a reticle MA (not shown in FIG. 4) on which the test structure P is positioned.

FIG. 5 depicts an alternative way to create a tilted beam (see also U.S. Pat. No. 6,710,853 B 1). FIG. 5 schematically depicts a cross section of a test device 20, for instance, made of quartz. The focus test device 20 has a pattern with chrome parts 21, that block impinging light. In between the chrome parts 21, a phase step is etched in the quartz. This phase step is formed by a first part 22 and a second part 23. The height of the first part 22 relative to the height of the second part 23 is chosen such that a phase shift of 90° is provided at the used wavelength. As a result, light that passes through the first part 22 has a 90° phase difference with respect to light that passes through the etched second part 23. The lengths in the x-direction of the chrome parts 21, the first parts 22 and the second parts 23 are in a proportion of 2:1:1.

Light that passes through the test device 20 is diffracted. It can be shown that the wave fronts of the minus first orders resulting from the first part 22 and the second part 23 have a 180° phase difference and cancel each other. The zero orders have 45° phase difference and are slightly weakened, while the plus first orders have a 0° phase difference. Therefore, only the zero and the plus first order are present, while the minus first order is not present. This also results in a tilted beam that can be used for performing tilted focus test.

It will be understood by a person skilled in the art that the solutions described with reference to FIGS. 4 and 5 can not easily be adopted for use in EUV applications. Wedge 10, for instance made of quartz, cannot be used for EUV application since it does not pass EUV radiation. The test device 20 as depicted in FIG. 5 is of a transmissive type, and is therefore also unsuitable for use in EUV applications, because EUV radiation would be substantially absorbed by regions 22, 23, if regions 22, 23 are made of quartz, for example. In principal, it could be possible to create a reflective version of the test device 20. However, since the wavelength of EUV is rather small (for instance 13 nm), the 90° phase step should be obtained by providing a height difference in the focus test pattern of 13/8 nm for a reflective mask, which requires an accuracy in the manufacture of the test device that is rather difficult to obtain. US2002/0015158 A1 describes a different way of performing a tilted focus test, i.e. by providing one or two blocking members in the illumination system. However, this approach has a number of disadvantages, as already discussed above.

Embodiment 1

FIG. 6 shows a projection apparatus comprising a radiation system 2, an illumination optics unit 4, and projection system PL. The radiation system 2 comprises radiation source LA which may be formed by a discharge plasma. EUV radiation may be produced by a gas or vapor, such as Xe gas or Li vapor in which a very hot plasma is created to emit radiation in the EUV range of the electromagnetic spectrum. The very hot plasma is created by causing a “partially ionized” plasma of an electrical discharge to collapse onto an optical axis O. Partial pressures of e.g. 10 Pa of Xe or Li vapor or any other suitable gas or vapor may be required for efficient generation of the radiation. The radiation emitted by radiation source LA is passed from a source chamber 7 into a collector chamber 8, e.g. via a gas barrier structure or contamination trap 9 (which is positioned in or behind an opening in source chamber 7). The gas barrier structure 9 may comprise a channel structure such as, for instance, described in detail in European patent applications EP 1 057 079 and EP 1 223 468, which are incorporated herein by reference.

The collector chamber comprises a radiation collector 10 which may be formed by a grazing incidence collector. Radiation passed by collector 10 is reflected off a grating spectral filter 11 to be focused in a virtual source point 12 at an aperture in the collector chamber 8. From collector chamber 8, a projection beam 16 is reflected in illumination optics unit 4 via normal incidence reflectors 13, 14 onto reticle or mask MA (not shown) positioned on a support structure, such as a reticle or mask table MT. A patterned beam 17 is formed which is imaged in projection system PL via reflective elements 18, 19 onto wafer stage or substrate table WT. More elements than shown may generally be present in illumination optics unit 4 and projection system PL. For instance, an EUV lithographic apparatus may have nine reflective elements, two in the illumination system IL, six in the projection system PL, and finally reflecting mask MA.

FIGS. 7 a and 7 b depict a projection apparatus according to an embodiment of the invention and show an enlarged detail of FIG. 6. The projection apparatus according to FIGS. 7 a and 7 b further comprises a tilting device 100 arranged to tilt the reticle (also termed “mask”) MA. The reticle is suitable to be used in EUV applications, and may also be referred to as a reflective device, serving to impart the projection beam with a pattern in its cross-section. For example, the mask may contain high reflection mirrors configured to reflect radiation in the wavelength range of about 5-100 nm. Preferably, the mask is configured to operate at least in the wavelength range of about 5-20 nm.

The tilting device 100 may be arranged to directly tilt the reflective device, but may also be arranged to tilt the support structure, such as the reticle or mask table MT. The support structure will further be referred to as mask table MT and the reflective device will further be referred to as reflective mask MA. As a result thereof, the reflective mask MA (not shown) positioned on the mask table MT can be tilted. The tilt of the mask table MT and the reflective mask MA is performed about a rotation axis (not shown) that is perpendicular to the plane of the drawing.

The tilting device is here depicted as a square box, but a person skilled in the art will realize how such a tilting device can be constructed. For instance, according to the state of the art, the mask table MT may be provided with actuators, arranged to adjust the orientation of the mask table MT in six degrees of freedom. Other, equivalent constructions known to persons skilled in the art could be applied instead.

The tilting device 100 can be controlled by an electronic control unit ECU. This electronic control unit ECU may be a computer arrangement, such as a central computer arrangement controlling the projection apparatus, but may also be a separate electronic control unit ECU, receiving instructions from such a central computer arrangement. The communication between the electronic control unit ECU and the tilting device and/or the central computer arrangement may be performed wirelessly.

FIG. 7 a depicts the tilting device 100 and the mask table MT in a non-tilted position. FIG. 7 b shows the tilting device 100 and the mask table MT in a tilted position. For reasons of clarity, in FIG. 7 b, the tilting device 100, the mask table MT and the patterned beam 17 are also depicted in the non-tilted position (dashed lines).

FIGS. 7 a and 7 b further shows the projection beam 16 that is reflected in the illumination optics unit 4 via normal incidence reflectors 13, 14 (not shown in FIGS. 7 a and 7 b) onto reflective mask MA (not shown) positioned on mask table MT.

If the mask table MT is not tilted, the projection beam 16 is reflected by the reflective mask MA and a first patterned beam 17 is formed which is imaged in projection system PL via reflective elements 18, 19 onto wafer stage or substrate table WT. The first patterned beam 17 is identical to the patterned beam 17 as shown in FIG. 6. The first patterned beam 17, formed from reflection of projection beam 16, and imaged onto WT in projection system PL, can thus be termed a projected projection beam.

It is noted that the first patterned beam 17 is in fact a tilted beam, as can be seen in FIG. 7 a. This is due to the layout of the projection system PL. However, based on this single first patterned beam 17, no tilted defocus test can be performed. In order to perform a defocus test, i.e. to determine a lateral shift of a projected patterned beam at the level of the substrate table WT, a reference is needed, as is already explained above. This reference is provided by using the tilting device 100 to create a single patterned beam that has a substantially different tilt than the first patterned beam, as will be explained with reference to FIG. 7 b.

If the mask table MT is tilted into a tilted position by the tilting device 100, the projection beam 16 is reflected by the tilted reflective mask MA (not shown) and a second tilted patterned beam 17′ is formed, which is also imaged in projection system PL via reflective elements 18, 19 onto wafer stage or substrate table WT.

Because of the tilting device 100, a first and a second patterned beam 17, 17′ can be created, the first and second patterned beam 17, 17′ having different tilt values, i.e. the first and second patterned beam 17, 17′ being tilted with respect to each other. This difference in tilt can be used to perform a defocus test as will be explained below, with reference to FIGS. 8 a, 8 b, 8 c and 8 d.

FIG. 8 a shows imaging of, for instance, a test device I (not shown) using a first patterned beam 17. Such a test device I may be a reflective mask MA, but may also be a part of a reflective mask, such as a marker. The substrate table WT is positioned such that the substrate W (not shown) is in the focal plane FP of the projection system PL. As a result, the test device I is imaged as a sharp image I′ at a position x₀. The focal plane FP is the plane of best focus.

FIG. 8 b shows the same situation, but now using a second, tilted patterned beam 17′. Again, the test device is imaged as a sharp image I″ at a position x₀.

FIG. 8 c shows imaging of the test device I using a first patterned beam 17, when no special tilt is given to the patterned beam 17. The substrate table WT is positioned a distance D below the focal plane FP. As a result, the test device I is imaged as a blurred image I′″ at a position x₁. The position x₁ of this blurred image I′″ is different from the position x₀ of the sharp image I′, I″.

Finally, FIG. 8 d shows imaging of the test device I using a second patterned beam 17′. The substrate table WT is positioned a distance D below the focal plane FP. As a result, the test device I is imaged as a blurred image I″″ at a position x₂. The position x₂ of this blurred image I″″ is different from the position x₀ of the sharp image I,′ I,″ and is also different from the position x₁ of the blurred image I′″ shown in FIG. 8 c.

It will be understood that the amount of lateral shift x₁, x₂ of the images is directly proportional to the amount of defocus D. The defocus D is the distance substantially in the direction of the patterned beam 17, 17′ at which the substrate W is positioned away from the focal plane FP. If the substrate W is positioned below the focal plane FP, as depicted in FIGS. 8 c and 8 d, the lateral shift x₁, x₂ of the images is in a first direction (left according in the situation depicted in FIGS. 8 c and 8 d). If the substrate W is positioned above the focal plane, the lateral shift x₁, x₂ of the images is in an opposite second direction.

The position of the images I,′ I,″ or the average position of blurred imaged I,′″ I″″ may for instance be determined by using a scanning tunneling microscope (SEM) or an other suitable apparatus can be used. The appropriate way to determine the position depends on the test feature which is used.

As can be seen in FIGS. 8 c and 8 d, the lateral shift x₁, and the lateral shift x₂ have different values for different values of the defocus D. Only in the case the defocus D equals zero, both lateral shifts x₁, x₂ equal zero. The difference between these two values, the relative position Δx (Δx=x₁−x₂) can now be used as a measure for determining the amount of defocus D.

Several ways of measuring the position of a blurred image can be applied, for instance, the middle of the blurred image can be measured. Another method is to determine the ‘center of gravity’ of the feature, as will be understood by a skilled person.

When determining the amount of defocus, a test device I is first imaged using a first patterned beam 17, and subsequently using a second patterned beam 17′, which is given a specific tilt with respect to the first patterned beam 17. In a next step, the relative position Δx of the two images is determined. The sign of Δx gives information about the sign of the defocus D (above or below the focal plane FP) and the absolute value |Δx| provides information about the amount of defocus D. Based on this, the position of the substrate table WT can be adjusted to position the substrate W in the focal plane FP. Also other actions can be taken to improve the focus, such as adjusting the setting of the projection system PL.

It will be understood that for performing this method, a calibration graph or table should be determined, from which the value and sign of D can be determined based on the determined value and sign of Δx.

A calibration graph can be obtained by performing a sequence of focus test measurements as described above, while varying the defocus. Measurements can be done with a defocus say of −0.300 μm, −0.150 μm, 0 μm, +0.150 μm and +0.300 μm. For each value of the defocus D, the relative position Δx is determined. The lateral shift is determined using techniques referred to above. Due to the tilt of the measurement beam, the behaviour of the lateral shift with focus will be mainly linear.

As a result of lens aberrations, the ideal focal plane FP may be different for a test device I_(x) having a pattern formed in the x direction (e.g. a grating having lines that extend in the y direction, being substantially perpendicular to the x direction), than for a test device I_(y), having a pattern formed in the y direction. The defocus method as described above may therefore be performed for the x and y direction.

Since the method as described here could be used to determine the defocus in x and y direction, it will be understood that also lens aberrations could de derived from this. For instance, based on the determined defocus in the x and y direction astigmatism and, e.g. astigmatism curvature which may be corrected for in the projection system PL can be obtained.

After the calibration curve is determined, the calibration curve can be used to determine the focus of imaged test devices. The calibration curves may be used for focus tests performed thereafter. The obtained calibration curve can be used if the following conditions are met:

-   -   1) the lithographic projection apparatus remains stable         (otherwise recalibration is needed after a certain time period),         and     -   2) conditions remain the same as during calibration (same         resist, illumination settings etc.).

The calibration curve may be used for performing actual focus tests according to the invention. The focus test according to the invention may be performed on the entire surface of a substrate W, but may also be used to determine the focus on specific areas of the substrate W (e.g. scribe lanes).

The focus test may be used to test the focus on the entire surface of a substrate W. This may be done by printing test patterns to the entire layer of resist provided on the substrate W while positioning the substrate W according to a height map obtained by a level sensor. Such a height map comprises information about the height of the substrate W on different x,y locations on the substrate W. Based on such a determined height map, an optimal position of the substrate W with respect to the projection system PL is computed. Since, in general a substrate W, especially one in which microscopic devices are being built, is not a flat object, but may have a myriad of local height variations, it is difficult to have the entire exposure area within the focal plane.

The actual obtained focus can be determined by projecting test patterns provided on test devices to the entire substrate. After the substrate W is exposed and the test patterns are developed, the actual obtained focus can be determined and a focus map can be generated from the entire substrate surface. Such a focus map comprises data representing the actual obtained (de-)focus on different x,y locations on the substrate W. This is done by measuring the lateral shift of each printed test pattern using known techniques and determining the defocus D.

After this, the resist can be removed and a new layer of resist can be applied to the substrate W (none destructive), which can be used for exposing the actual pattern on the substrate W. The obtained focus map can then be used to project the actual pattern more accurately onto the substrate W.

However, in an alternative embodiment, the test pattern provided on the test device is projected on scribe lanes. These scribe lanes are outside the target portions C on which the actual product patterns are printed. This technique allows a combination of “real” exposure and monitoring at the same time and there is no need to remove the resist as in the example above.

In both cases, the test pattern provided on the test device is imaged in the layer of resist, and the substrate W is subsequently removed from the lithographic apparatus and transported into a track. Inside the track, the printed test patterns, that are still latent, are made detectable, for instance by performing a post exposure bake. After this, the lateral shift of the printed test patterns is determined, using known techniques.

The method and apparatus described here, a tilted defocus test, can be performed relatively easily and rapidly.

Embodiment 2

According to the first embodiment, the first and the second patterned beam 17, 17′ project the images such that they at least partially overlap. Determining the relative shift of overlapping projected test devices is a rather difficult procedure. Two relatively shifted lines that are projected on top of each other may result in one single broader line. It is difficult to distinguish the change of line width due to the actual focus conditions and other effects, such as processing, dose variations etc.

Therefore, the projection of the first and second patterned beam 17, 17′ can be positioned at a predetermined offset distance with respect to each other. It is advantageous to provide the two projections with an offset x_(offset), as shown in FIG. 9 a. The test device I is imaged using the first patterned beam 17 at a first position x₁, and is imaged using the second pattern beam 17′ at a second position x₂. If the substrate W is in the focal plane, the distance between the first and second position equals x_(offset) (x_(offset)=x₁−x₂).

In case the substrate W is not positioned in the focal plane, as depicted in FIG. 9, both the first and second images I′″, and I″″ are shifted laterally. However, the lateral shift of both images is different, and thus, again Δx can be computed: Δx=x₁−x₂−x_(offset).

By providing an offset, the images I′″, I″″ do not overlap, and thus, their positions can be determined in a more accurate and easy way.

Embodiment 3

In a further embodiment, the accuracy and sensitivity of the determined Δx and thus of the defocus D can be increased. This is done by using the test device to provide the first patterned beam 17 with a tilt in a direction opposite to the direction of the second patterned beam 17′. This is depicted in FIG. 10.

Using the tilting device 100, the patterned beam 17 can be given an appropriate tilt. According to the embodiment described with reference to FIG. 10, the first patterned beam 17 is given a tilt in a first direction with respect to a non-tilted beam. The term non-tilted beam as used herein denotes a patterned beam 17, as depicted in FIG. 6, in the case where the mask MA is not provided with a specific tilt. The second patterned beam 17′ is given a tilt in a second direction, being opposite to the first direction. The first and second tilt may have a similar value with opposite signs, but may also have different values.

According to the embodiment in FIG. 10, the first and second image I′″, I″″ may be given an offset x_(offset) with respect to each other as described in embodiment 2. It will be understood that this offset may also be zero, as in embodiment 1, discussed with reference to FIGS. 8 a, b, c and d.

Embodiment 4

According to a further embodiment, the tilt may also be provided by one of the other optical elements provided, as for instance shown in FIG. 6. The tilt may be introduced by providing a tilting device 100 to tilt normal incidence reflectors 13, 14 positioned in illumination optics unit 4. Also, reflective elements 18, 19 provided in projection system PL may be tilted to create a tilted patterned beam.

The optical element tilted is preferably in an image plane of the patterned beam. Also optical elements that are not in an image plane may be used. However, tilting optical elements not being in an image plane, will introduce additional aberrations. Such aberrations may need to be corrected for.

In accordance with one aspect of the invention, a method for performing a tilted focus test by providing a target object and providing a projection beam of radiation using a radiation source, is characterized by the steps of providing a reflective device to introduce a projected projection beam of radiation onto the target portion, introducing a first projected projection beam of radiation onto the target object using the reflective device in a first orientation, using a tilting device for tilting the reflective device to a second orientation to provide a second projection beam with a tilt relative to said first projection beam, introducing a second projected projection beam of radiation onto the target object, determining a lateral shift of the first and second projected projection beams on the target object and determining from said lateral shift a defocus of the target object with respect to the projected projection beam.

In accordance with a further aspect of the invention, an exposure apparatus that includes a table for holding a target object and a radiation source configured to provide a projection beam of radiation, is further characterized by a reflective device configured to introduce a projected projection beam of radiation onto the target portion; a tilting device configured to tilt the reflective device to provide the projection beam with a tilt; and an electronic control unit that is configured to i) control the exposure apparatus to arrange the reflective device in a first orientation and introduce a first projected projection beam of radiation onto the target object, ii) tilt the reflective device to a second orientation using the tilting device, iii) introduce a second projected projection beam of radiation onto the target object, the second projected projection beam being tilted with respect to the first projected projection beam, iv) determine a lateral shift of the first and second projected projection beams on the target object, and v) determine from said lateral shift a defocus of the target object with respect to the projected projection beam.

While aspects of the invention discussed above refer to projected projection beams of radiation 17, that are patterned beams of radiation, the scope of this invention includes determination of defocus using projected projection beams that can be unpatterned beams of radiation.

While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. For example, the invention may take the form of a computer program containing one or more sequences of machine-readable instructions arranged to control movement of the mask or reticle table MT (or mask or reticle MA directly) to perform a method as disclosed above, or a data storage medium (e.g. semiconductor memory, magnetic or optical disk) having such a computer program stored therein.

The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below. 

1. A method for performing a tilted focus test, comprising: providing a target object; introducing a first projected projection beam of radiation onto the target object using a reflective device in a first orientation; using a tilting device for tilting the reflective device to a second orientation to provide a second projected projection beam with a tilt relative to said first projected projection beam; introducing the second projected projection beam of radiation onto the target object; determining a lateral shift of the first and second projected projection beams on the target object; and determining from said lateral shift a defocus of the target object.
 2. The method according to claim 1, wherein the reflective device is provided with a pattern to impart the projection beam with a pattern in its cross-section for creating a first and second patterned beam.
 3. The method according to claim 1, wherein the first and second projected projection beams are projected onto the target object at a predetermined offset distance with respect to each other and the lateral shift is determined with respect to the offset distance.
 4. The method according to claim 1, wherein the tilting device is used to provide the first projected projection beam with a first tilt, and the second projected projection beam with a second tilt, the first and second tilt having an opposite sign with respect to a non-tilted projected projection beam.
 5. The method according to claim 1, wherein the method further comprises: adjusting a relative position of the target object with respect to a focal plane determined from the defocus of the target object.
 6. The method according to claim 1, wherein the target object is a substrate used in lithographic techniques and the method further comprises: subjecting the substrate to a post exposure treatment before determining the lateral shift of the projected first and second projection beam.
 7. The method according to claim 1, wherein said target object is a semiconductor substrate.
 8. An exposure apparatus, comprising: a table for holding a target object; a radiation source configured to provide a projection beam of radiation; a reflective device configured to introduce a projected projection beam of radiation onto the target portion; a tilting device configured to tilt the reflective device to provide the projection beam with a tilt; and an electronic control unit configured to control the exposure apparatus to arrange the reflective device in a first orientation and introduce a first projected projection beam of radiation onto the target object, tilt the reflective device to a second orientation using the tilting device, introduce a second projected projection beam of radiation onto the target object, the second projected projection beam being tilted with respect to the first projected projection beam, determine a lateral shift of the first and second projected projection beams on the target object, and determine from said lateral shift a defocus of the target object.
 9. An exposure apparatus according to claim 8, wherein the reflective device is provided with a pattern configured to impart the projection beam with a pattern in its cross-section.
 10. An exposure apparatus according to claim 8, wherein the tilting device is arranged to tilt the reflective device directly.
 11. An exposure apparatus according to claim 8, wherein the tilting device is arranged to tilt a support structure carrying the reflective device.
 12. An exposure apparatus according to claim 9, the reflective device comprising a plurality of reflective elements for projecting a patterned projection beam of radiation onto the target object, wherein the first and second projected projection beams are patterned beams.
 13. An exposure apparatus according to claim 8, wherein the exposure apparatus is a lithographic apparatus and the target object is a substrate.
 14. A method of substrate patterning in a lithography apparatus, comprising: forming a first patterned beam of radiation by reflecting a beam of radiation from a reflecting device; introducing the first patterned beam of radiation onto a first substrate at a first tilt; forming a second patterned beam of radiation by reflecting a beam of radiation from the reflecting device; introducing the second patterned beam of radiation onto the first substrate at a second tilt; determining a lateral shift between first and second images formed in the substrate by the respective first and second patterned beams of radiation; determining a focal plane of the first and second patterned beams of radiation based on the determined lateral shift; and projecting an additional patterned beam of radiation formed from the reflecting device onto one or more substrates arranged substantially with the focal plane of the first and second patterned beams of radiation.
 15. The method of claim 14, wherein the lithography apparatus is an EUV lithography tool, wherein the reflecting device is a reflecting mask configured to operate for radiation having a wavelength in the range of 5 to about 20 nm.
 16. The method of claim 14, wherein the reflecting device is a reflecting mask.
 17. The method of claim 14, further comprising: providing a photoresist layer on the substrate; and forming the first and second images in the photoresist layer.
 18. The method of claim 14, further comprising providing an offset within the substrate between the first and second images.
 19. The method of claim 1, further comprising providing one or more reflective elements, the reflective elements configured to direct the first and second patterned beams of radiation onto the substrate in conjunction with the reflective device.
 20. A method for performing a tilted focus test, comprising: directing a first beam of radiation onto a target object using a reflective device in a first orientation; tilting the reflective device to a second orientation to provide a second of radiation beam with a tilt relative to the first of radiation beam; directing the second reflected beam onto the target object; determining a lateral shift of the first and second beams of radiation on the target object; and determining from the lateral shift a defocus of the target object. 